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Tags: Orange Pi AI Stick Lite, with Plai Model Transformation Tools Neural Network Computing Artificial Intelligence, opi-ai-stick-lite, SBC Boards
Orange Pi AI Stick Lite, with Plai Model Transformation Tools Neural Network Computing Artificial Intelligence
AI Processor: Series of the Chip: Lightspeeur Module of the Chip: SPR2801S High Energy Efficiency: 9.3 TOPs/Watt Ultra Low Power: 2.8 TOPs @300mW Best Peak Performance: 5.6 TOPs @100MHz Hardware Interface: SDIO3.0 eMMC 4.5 Sealed Package of the Chip: BGA (7mm*7mm) Fabrication Process: 28nm
Type of Connection: USB 2.0, USB3.0 Type-A. Speed(MAX): read bandwidth = 68.00 MB/s, write bandwidth = 84.69 MB/s
PLAI training tools and related files are provided for free, if you need them, pls contact us to get them.
Features:
Support USB2.0 and 3.0 standard communication interface
No programming, no language barriers
Open SDK can be applied to platforms such as X86, ARM, etc.
Support Android, Linux, and other operating systems
Support VGG, SSD, and other neural network models
Modle: Orange Pi AI Stick
AI Processor:
Series of the Chip: Lightspeeur
The module of the Chip: SPR2801S
High Energy Efficiency: 9.3 TOPs/Watt
Ultra Low Power: 2.8 TOPs @300mW
Best Peak Performance: 5.6 TOPs @100MHz
Hardware Interface: SDIO3.0 eMMC 4.5
Sealed Package of the Chip: BGA (7mm*7mm)
Fabrication Process: 28nm
Type of Connection: USB 2.0, USB3.0 Type-A
Speed(MAX): read bandwidth = 68.00 MB/s, write bandwidth = 84.69 MB/s
Supported Framework: Caffe, PyTorch, (TensorFlow will be supported soon)
Supported Model: Supported Model
Operating System: X86 LinuxUbuntu 16.04 ARM Linux ARM AndroidARM v7ARM v8
Working Voltage: DC 5V 200mA
Working Temperature: 0° C to 40° C
Storage Temperature: -20° C to 80° C
Physical Dimension: 66.5 mm x 20.5 mm x 10.8 mm
Training Tool: Plai("full-stack"Framework Based on PyTorch)
Software:
"SDK of ARMX86 SDK, Built-in 1-2 model demonstrations; Model training tool PlaiTM"
Note: PLAI training tools and related Files need to be purchased separately
AI Processor: Series of the Chip: Lightspeeur Module of the Chip: SPR2801S High Energy Efficiency: 9.3 TOPs/Watt Ultra Low Power: 2.8 TOPs @300mW Best Peak Performance: 5.6 TOPs @100MHz Hardware Interface: SDIO3.0 eMMC 4.5 Sealed Package of the Chip: BGA (7mm*7mm) Fabrication Process: 28nm
Type of Connection: USB 2.0, USB3.0 Type-A. Speed(MAX): read bandwidth = 68.00 MB/s, write bandwidth = 84.69 MB/s
PLAI training tools and related files are provided for free, if you need them, pls contact us to get them.
Features:
Support USB2.0 and 3.0 standard communication interface
No programming, no language barriers
Open SDK can be applied to platforms such as X86, ARM, etc.
Support Android, Linux, and other operating systems
Support VGG, SSD, and other neural network models
Modle: Orange Pi AI Stick
AI Processor:
Series of the Chip: Lightspeeur
The module of the Chip: SPR2801S
High Energy Efficiency: 9.3 TOPs/Watt
Ultra Low Power: 2.8 TOPs @300mW
Best Peak Performance: 5.6 TOPs @100MHz
Hardware Interface: SDIO3.0 eMMC 4.5
Sealed Package of the Chip: BGA (7mm*7mm)
Fabrication Process: 28nm
Type of Connection: USB 2.0, USB3.0 Type-A
Speed(MAX): read bandwidth = 68.00 MB/s, write bandwidth = 84.69 MB/s
Supported Framework: Caffe, PyTorch, (TensorFlow will be supported soon)
Supported Model: Supported Model
Operating System: X86 LinuxUbuntu 16.04 ARM Linux ARM AndroidARM v7ARM v8
Working Voltage: DC 5V 200mA
Working Temperature: 0° C to 40° C
Storage Temperature: -20° C to 80° C
Physical Dimension: 66.5 mm x 20.5 mm x 10.8 mm
Training Tool: Plai("full-stack"Framework Based on PyTorch)
Software:
"SDK of ARMX86 SDK, Built-in 1-2 model demonstrations; Model training tool PlaiTM"
Note: PLAI training tools and related Files need to be purchased separately
